Suhir ephraim (24 Ergebnisse)

XXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Zustand: New. pp. lxii + 1460 Illus.

Zustand: New. In English.

Zustand: New.

Zustand: New.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in 'high technology' engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.…

Paperback. Zustand: Brand New. 237 pages. 9.25x6.14x0.67 inches. In Stock.

Zustand: New. In English.

Paperback. Zustand: Brand New. 406 pages. 9.18x6.12x9.21 inches. In Stock.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New.

Zustand: New. pp. 336.

Gebunden. Zustand: New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.

Zustand: New. In English.

Zustand: New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Connally, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. In English.

Buch. Zustand: Neu. Neuware - The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro and opto electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In depth discussion from a mechanical engineer s viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.…

Hardcover. Zustand: Brand New. 382 pages. 9.75x6.50x1.00 inches. In Stock.

Hardcover. Zustand: Brand New. 225 pages. 9.75x6.50x0.75 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This handbook is the first comprehensive reference to collect and present up-to-date, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and gives practical recommendations on how to successfully apply current knowledge in this field. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product. The handbook can be as a manual for self-education. It is an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging, and reliability, with an emphasis on physical design problems, challenges, and solutions.…