Semiconductor reliability (67 Ergebnisse)

Hardback. Zustand: Fair. Semiconductor Memories provides in-depth coverage in the areas of design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods including. * Memory cell structures and fabrication technologies. * Application-specific memories and architectures. * Memory design, fault modeling and test algorithms, limitations, and trade-offs. * Space environment, radiation hardening process and design techniques, and radiation testing. * Memory stacks and multichip modules for gigabyte storage.…

Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Very Good. No Jacket. Missing dust jacket; May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Soft Cover. Zustand: Very Good. Softcovers; in very good condition.

Zustand: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: As New. Unread book in perfect condition.

Zustand: As New. Unread book in perfect condition.

Zustand: As New. Unread book in perfect condition.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. pp. xiii + 195 137 Illus.

Zustand: New. *Price HAS BEEN REDUCED by 10% until Monday, Nov. 2 (weekend sale item)* 240 pp., HARDCOVER (same isbn), new. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. Photos available upon request.…

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Zustand: New. pp. 216.

gebundene Ausgabe. Zustand: Gut. 536 Seiten Das hier angebotene Buch stammt aus einer teilaufgelösten Bibliothek und kann die entsprechenden Kennzeichnungen aufweisen (Rückenschild, Instituts-Stempel.); der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Einband folienkaschiert. In ENGLISCHER Sprache. Sprache: Englisch Gewicht in Gramm: 960. …

Hardcover. Zustand: Very Good. Condition: 'VG+. Sunned'.

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Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Zustand: New. pp. 522.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | In the present work, urgent issues in the reliability qualification of semiconductor devices are addressed, which particularly affect value chains such as those in the automotive industry. These have particularly high requirements for long lifetime and low failure rates of their products, which are additionally exposed to more extreme operating and environmental conditions than in most other areas of application. In particular, the question arises on how to assess a product or semiconductor technology against the requirement of an application-specific mission profile with multiple non-constant stressors. For this purpose, the behavior of failure distributions under varying and progressive stress loads is investigated and described using cumulative damage models. For the first time, the industry-wide approach of transforming non-constant mission profiles into effective constant stress and test conditions for reliability assessment and qualification can be physically justified and substantiated with measurement data. This stress transformation is exemplified using the time-dependent dielectric breakdown (TDDB) failure mechanism with the two stressors voltage and temperature; and then extended to include the use of multi-dimensional mission profiles and interdependent stressors. These measurements are performed on university metal¿oxide¿semiconductor (MOS) capacitors as well as on commercially available state-of-the-art transistors. Finally, it is demonstrated that the obtained findings in the field of cumulative damage can be applied to use reliability studies with ramp-stress for acceleration model verification and to determine model parameters with less time and experimental effort.…

Zustand: Sehr gut. Auflage: 1. 480 Seiten kleine Lagerspuren am Buch, Inhalt einwandfrei und ungelesen Sprache: Englisch Gewicht in Gramm: 1035 25,7 x 18,0 x 3,3 cm, Gebundene Ausgabe.

Zustand: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | In the present work, urgent issues in the reliability qualification of semiconductor devices are addressed, which particularly affect value chains such as those in the automotive industry. These have particularly high requirements for long lifetime and low failure rates of their products, which are additionally exposed to more extreme operating and environmental conditions than in most other areas of application. In particular, the question arises on how to assess a product or semiconductor technology against the requirement of an application-specific mission profile with multiple non-constant stressors. For this purpose, the behavior of failure distributions under varying and progressive stress loads is investigated and described using cumulative damage models. For the first time, the industry-wide approach of transforming non-constant mission profiles into effective constant stress and test conditions for reliability assessment and qualification can be physically justified and substantiated with measurement data. This stress transformation is exemplified using the time-dependent dielectric breakdown (TDDB) failure mechanism with the two stressors voltage and temperature; and then extended to include the use of multi-dimensional mission profiles and interdependent stressors. These measurements are performed on university metal¿oxide¿semiconductor (MOS) capacitors as well as on commercially available state-of-the-art transistors. Finally, it is demonstrated that the obtained findings in the field of cumulative damage can be applied to use reliability studies with ramp-stress for acceleration model verification and to determine model parameters with less time and experimental effort.…

Zustand: New. In English.

Zustand: New. pp. 536.

Zustand: Good.

Paperback. Zustand: Brand New. 216 pages. 9.21x6.14x0.63 inches. In Stock.

Taschenbuch. Zustand: Neu. Semiconductor Packaging | Materials Interaction and Reliability | Andrea Chen (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2017 | CRC Press | EAN 9781138075405 | Verantwortliche Person für die EU: Taylor and Francis, Taylor & Francis Verlag Gmbh, Kaufingerstr 24, 80331 München, gpsr[at]taylorandfrancis[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. Neuware.