Microelectronics packaging handbook (22 Ergebnisse)
- Hardcover
Anbieter: ThriftBooks-Atlanta, AUSTELL, USAThriftBooks-Atlanta
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EUR 7,92
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Hardcover. Zustand: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
- Hardcover
Anbieter: ThriftBooks-Dallas, Dallas, USAThriftBooks-Dallas
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EUR 7,92
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Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
- Hardcover
Anbieter: A Squared Books (Don Dewhirst), South Lyon, USAA Squared Books (Don Dewhirst)
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EUR 7,86
EUR 5,63 VersandVersand innerhalb von USAAnzahl: 1 verfügbar
Hardcover. Zustand: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additiona…l shipping charges may need to be requested due to size or weight of book.
- Hardcover
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EUR 6,29
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Zustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to t…he page edges/pages . Previous owners name inside the front page/cover.
- Hardcover
Anbieter: Anybook.com, Lincoln, Vereinigtes KönigreichAnybook.com
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EUR 33,04
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Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:…9780412084515.
- Hardcover
Anbieter: Anybook.com, Lincoln, Vereinigtes KönigreichAnybook.com
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EUR 33,43
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Zustand: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515.
- Hardcover
Anbieter: Anybook.com, Lincoln, Vereinigtes KönigreichAnybook.com
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EUR 33,46
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Zustand: Good. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780412084416.
Microelectronics Packaging Handbook Pt. III : Subsystem Packaging
Klopfenstein, Alan G., Rymaszewski, Eugene J., Tummala, Rao R.
- Hardcover
Anbieter: Better World Books: West, Reno, USABetter World Books: West
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EUR 66,50
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Zustand: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
- Hardcover
Anbieter: Books From California, Simi Valley, USABooks From California
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EUR 65,10
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Hardcover. Zustand: Very Good. The copy shows minor external wear, but is in otherwise clean condition.
Microelectronics Packaging Handbook, Vols. 1-3
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao Tummala R.R.
Anbieter: Majestic Books, Hounslow, Vereinigtes KönigreichMajestic Books
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EUR 49,66
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Zustand: New. pp. 1000.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
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EUR 164,59
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Zustand: New. In.
- Hardcover
Anbieter: moluna, Greven, Deutschlandmoluna
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EUR 180,46
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Gebunden. Zustand: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
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EUR 225,71
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Zustand: New. In.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Softcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
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EUR 225,71
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Zustand: New. In.
- Hardcover
Anbieter: Kennys Bookstore, Olney, USAKennys Bookstore
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EUR 250,41
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Zustand: New. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, biogr…aphy. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100. . 1997. 2nd ed. 1997. Hardback. . . . . Books ship from the US and Ireland.
Weitere Bilder- Softcover
Anbieter: preigu, Osnabrück, Deutschlandpreigu
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EUR 184,85
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Taschenbuch. Zustand: Neu. Microelectronics Packaging Handbook | Technology Drivers Part I | R. R. Tummala (u. a.) | Taschenbuch | xxvii | Englisch | 2012 | Springer | EAN 9781461368298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbie…ter: preigu.
- Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
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EUR 224,59
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Buch. Zustand: Neu. Neuware - This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelec…tronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
- Softcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. H…ong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
- Hardcover
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EUR 246,21
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Gebunden. Zustand: New. Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kon.
- Hardcover
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EUR 305,57
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Buch. Zustand: Neu. Neuware - Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current… growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
- Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
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EUR 388,16
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kon…g, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books
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CD-ROM. Zustand: Brand New. 2nd edition. 1000 pages. 7.00x7.25x1.00 inches. In Stock.
