Microtechnology and mems - 9783540221876 - force sensors for microelectronic packaging applications (microtechnology and mems) von schwizer, jürg; mayer, michael; brand, oliver (6 Ergebnisse)

149 figs., VIII, 178 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Microtechnology and Mems. Sprache: Englisch.…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Used. pp. 188 Illus.

Zustand: Used. pp. 188.

Zustand: New. In.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.…