Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS) - Hardcover

Buch 2 von 17: Microtechnology and MEMS

Schwizer, Jürg; Mayer, Michael; Brand, Oliver

 
9783540221876: Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)
Hardcover
ISBN 10: 3540221875 ISBN 13: 9783540221876
Verlag: Springer, 2004

Inhaltsangabe

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

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Von der hinteren Coverseite

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

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Verlag
Springer
Erscheinungsdatum
2004
Sprache
Englisch
ISBN 10 
3540221875
ISBN 13 
9783540221876
Einband
Gebundene Ausgabe
Anzahl der Seiten
186
Kontakt zum Hersteller
Springer Palgrave Macmillan
buchhandel-buch@springer.com

Tiergartenstr. 17
Heidelberg
69121
Deutschland

Weitere beliebte Ausgaben desselben Titels

9783642060632: Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)

Vorgestellte Ausgabe

ISBN 10:  3642060633 ISBN 13:  9783642060632
Verlag: Springer, 2010
Softcover