Brand oliver (62 Ergebnisse)

Zustand: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

Broschiert. Zustand: Gut. 2. Aufl. XVI, 171 S. ; Der Erhaltungszustand des hier angebotenen Werks ist trotz seiner Bibliotheksnutzung sehr sauber. Es befindet sich neben dem Rückenschild lediglich ein Bibliotheksstempel im Buch; ordnungsgemäß entwidmet. Sprache: Deutsch Gewicht in Gramm: 400.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Zustand: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

1st ed. 18 x 25 cm. 392 pages. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

594 p. ill. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Advanced micro and nanosystems, vol. 2. Sprache: Englisch. …

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Paperback. Zustand: Brand New. German language. 9.37x6.18x0.55 inches. In Stock.

Paperback. Zustand: Brand New. German language. 9.49x6.54x0.63 inches. In Stock.

Regensburg, Schnell + Steiner 2011. 126 Seiten m. zahlreichen Abbildungen. Orig. Hardcover, Schutzumschl., quer 4°. Gut erhalten.

Zustand: New.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Very Good. : Este libro de tapa dura explora las tecnologías habilitadoras para MEMS (Sistemas Microelectromecánicos) y nanodispositivos. Publicado el 3 de septiembre de 2004, cuenta con 439 páginas y dimensiones físicas de 9.7 x 7 x 1 pulgadas, con un peso de 2.1 libras. Editado por Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink y Osamu Tabata, este libro es un recurso valioso en los campos de la química, la ingeniería mecánica y de materiales, la ciencia/matemáticas y la tecnología. EAN: 9783527307463 Tipo: Libros Categoría: Tecnología|Ciencias Título: Enabling Technologies for MEMS and Nanodevices Autor: Henry Baltes| Oliver Brand| Gary K. Fedder| Christofer Hierold| Jan G. Korvink| Osamu Tabata Editorial: Wiley-VCH Idioma: en Páginas: 439 Formato: tapa dura.…

Zustand: Used. pp. 188 Illus.

Zustand: Used. pp. 188.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: Used. pp. 140 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Zustand: New. In English.

Zustand: Used. pp. 140.

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.…

Zustand: New. In English.

Zustand: New. Presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. This title describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. Series: Microsystems. Num Pages: 121 pages, biography. BIC Classification: TDPB; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 9. Weight in Grams: 830. . 1999. Hardback. . . . . Books ship from the US and Ireland.…

Zustand: Gut. 2004, Bibliotheksexemplar - Schnitt: nachgedunkelt - Seiten: wie ungelesen, leicht nachgedunkelt.

Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems. Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity. Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements. The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm. Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development. …

Zustand: New. pp. 608.

Zustand: gut. 2004. Enabling Technologies for MEMS and Nanodevices: Advanced Micro and Nanosystems (Advanced Micro and Nanosystems, 1, Band 1) In deutscher Sprache. pages.

Hardcover. Zustand: gut. 1999. Micromachined Ultrasound-Based Proximity Sensors In englischer Sprache. pages.