Sprache: Englisch
Verlag: Wiley & Sons, Incorporated, John, 1991
ISBN 10: 0442207719 ISBN 13: 9780442207717
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XXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Zustand: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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In den WarenkorbZustand: New. pp. lxii + 1460 Illus.
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Taschenbuch. Zustand: Neu. Structural Analysis in Microelectronic and Fiber-Optic Systems | Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis | Ephraim Suhir | Taschenbuch | xiv | Englisch | 2012 | Springer | EAN 9789401165372 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Sprache: Englisch
Verlag: Springer, Springer Netherlands, 2012
ISBN 10: 9401165378 ISBN 13: 9789401165372
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in 'high technology' engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
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Anbieter: BooksRun, Philadelphia, PA, USA
Hardcover. Zustand: Fair. 2010. The item might be beaten up but readable. May contain markings or highlighting, as well as stains, bent corners, or any other major defect, but the text is not obscured in any way.
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In den WarenkorbHardcover. Zustand: Brand New. 306 pages. 9.25x6.18x0.87 inches. In Stock.
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In den WarenkorbZustand: New. pp. 336.
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In den WarenkorbZustand: New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.
Zustand: New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Connally, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
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Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.