John lau (154 Ergebnisse)

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. John Wu; Marc Ouellette (illustrator).

Zustand: New. pp. 144.

Zustand: New. pp. 112.

Zustand: New. pp. 144.

Zustand: New. pp. 112.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.

Zustand: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: New. pp. 80.

Hardback. Zustand: Good. Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.…

Zustand: Very Good. : Este libro técnico es una guía exhaustiva sobre el diseño, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnológicas necesarias para la miniaturización de componentes electrónicos.Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un análisis detallado de los desafíos de fabricación y las soluciones de ingeniería en el empaquetado de circuitos integrados modernos. EAN: 0639785306085 Tipo: Libros Categoría: Tecnología|Ciencias Título: Chip scale package Autor: John H. Lau| Ricky S. W. Lee Editorial: McGraw-Hill Idioma: en Páginas: 500 Formato: tapa dura.…

Zustand: Good. : Este libro técnico proporciona una guía exhaustiva sobre las tecnologías de microvías y WLCSP, fundamentales para el diseño y la fabricación de sistemas de interconexión de alta densidad y bajo costo. A través de sus páginas, los autores John H. Lau y S.W. Ricky Lee exploran métodos para crear sistemas electrónicos más eficientes y fiables, incluyendo más de 500 ilustraciones detalladas y fotografías que facilitan la comprensión de procesos complejos como la perforación láser y mecánica en placas de circuito impreso.Dirigido a profesionales y académicos del área de la ingeniería electrónica y de telecomunicaciones, el texto aborda temas críticos como los materiales electrónicos, el control de costes en la construcción de circuitos integrados y las tecnologías de empaquetado microelectrónico. Es una referencia esencial para aquellos interesados en las últimas innovaciones en hardware y componentes de circuitos. EAN: 0639785322092 Tipo: Libros Categoría: Tecnología Título: Microvias: For Low Cost, High Density Interconnects Autor: John H. Lau| S.W. Ricky Lee Editorial: McGraw-Hill Professional Idioma: en Páginas: 565 Formato: tapa dura.…

[168] pp.; 30.6 x 23 cm.; sewn bound; black-and-white & color; edition size 2500; unsigned and unnumbered; offset-printed Exhibition catalogue published in conjunction with show held June 16 - August 10, 1986. Essay by Christopher Knight. Introduction by Richard Koshalek. Artists include John Ahearn, Carl Andre, Richard Artschwager, Jennifer Bartlett, Jean-Michel Basquiat, Jonathan Borofsky, Richard Bosman, Troy Brauntuch, Scott Burton, Larry Clark, Peter Drake, Eric Fischl, Dan Flavin, Bryan Hunt, Mark Innerst, Neil Jenney, Donald Judd, Ellsworth Kelly, Anselm Kiefer, Rex Lau, Barry LeDoux, Robert Mangold, Brice Marden, Agnes Martin, Michael McClard, Malcolm Morley, Robert Moskowitz, Elizabeth Murray, Susan Rothenberg, Robert Ryman, David Salle, Julian Schnabel, Richard Serra, Joel Shapiro, Cindy Sherman, Frank Stella, Cy Twombly, and Terry Winters. Includes exhibition checklist. Very Good. Rubbing of cover edges with 1.5 cm. dog-ear to bottom right corner of recto and 2.7 cm. crease to bottom left corner of verso. Contents clean and unmarked. Due to large size and weight additional shipping charges will be required for international orders.…

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

paperback. Zustand: GOOD. 1,176 clean, unmarked, tight pages; soiling on outer edges of textblock; cover has light shelf and corner wear, a few spots, and small bumps at upper spine; May require extra shipping outside the U.S.

Zustand: New. In English.

unknown_binding. Zustand: Good. Minor shelf wear. Pages/covers clean.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Very Good. 1. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Hardcover. Zustand: Very Good.

Zustand: New. In English.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Zustand: Used - Very Good. VG paperback. Reprint, 2019. An very nice clean, tidy copy =, almost as-new. Colour and B&W illustrations.

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: Good. *FREE DOMESTIC SHIPPING until Monday, Oct. 19* 1379 pp., Paperback, ex library, else text clean and binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.…

Zustand: Very Good. 1st Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. …

Paperback. Zustand: Brand New. 115 pages. 11.00x8.50x0.27 inches. In Stock.

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.