Verwandte Artikel zu Solder Joint Reliability: Theory and Applications
Inhaltsangabe
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder’s uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Reseña del editor
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Reseña del editor
Featuring the contributions of industrial academic experts in this area of electronics packaging, this volume examines solder failure - one of the reliability problems facing the modern surface-mounted electronics.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Neu kaufen
Diesen Artikel anzeigen
EUR 218,61
EUR 13,81 für den Versand von Vereinigtes Königreich nach USA
Versandziele, Kosten & DauerWeitere beliebte Ausgaben desselben Titels
Suchergebnisse für Solder Joint Reliability: Theory and Applications
Beispielbild für diese ISBN
Solder Joint Reliability: Theory and Applications
Anbieter: Books From California, Simi Valley, CA, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: Good. Artikel-Nr. mon0003880299
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Solder Joint Reliability: Theory and Applications
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. In. Artikel-Nr. ria9780442002602_new
Anzahl: Mehr als 20 verfügbar
Beispielbild für diese ISBN
Solder Joint Reliability
Verlag:
Kluwer Academic Publishers Group, 1991
ISBN 10: 0442002602
ISBN 13: 9780442002602
Neu
Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USA
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. Featuring the contributions of industrial academic experts in this area of electronics packaging, this volume examines solder failure - one of the reliability problems facing the modern surface-mounted electronics. Num Pages: 631 pages, 146 black & white illustrations, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 34. Weight in Grams: 2400. . 1991. Hardback. . . . . Books ship from the US and Ireland. Artikel-Nr. V9780442002602
Anzahl: 15 verfügbar
Foto des Verkäufers
Solder Joint Reliability : Theory and Applications
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. Neuware - Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer. Artikel-Nr. 9780442002602
Anzahl: 2 verfügbar