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Electronic Packaging Materials and Their Properties (Electronic Packaging Series) - Hardcover

Buch 3 von 4: Electronic Packaging

Agarwal, Rakesh; McCluskey, Patrick; Dishongh, Terrance; Javadpour, Sirus; Mahajan, Rahul

 
9780849396250: Electronic Packaging Materials and Their Properties (Electronic Packaging Series)
Hardcover
ISBN 10: 0849396255 ISBN 13: 9780849396250
Verlag: CRC Press, 1998

Inhaltsangabe

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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    Über die Autorin bzw. den Autor

    Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

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    Verlag
    CRC Press
    Erscheinungsdatum
    1998
    Sprache
    Englisch
    ISBN 10 
    0849396255
    ISBN 13 
    9780849396250
    Einband
    Gebundene Ausgabe
    Anzahl der Seiten
    114
    Herausgeber
    Pecht Michael G.
    Kontakt zum Hersteller
    preigu GmbH & Co. KG
    mail@preigu.de

    Lengericher Landstr. 19
    Osnabrück
    Niedersachsen
    49078
    Deutschland