Rapid thermal processing (21 Ergebnisse)

Paperback. Zustand: Brand New. 440 pages. 9.00x6.00x1.00 inches. In Stock.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 376 | Sprache: Englisch | Produktart: Bücher | Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.…

Hardcover. Zustand: Brand New. 356 pages. 11.00x8.25x0.50 inches. In Stock.

Zustand: New. In English.

Zustand: Very Good. 1st Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. …

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 430 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: New. A collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. It covers the following areas such as advanced MOS gate stack, integration technologies..

Zustand: New. pp. 164 Illus.

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Neuware - This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.…

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. Proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995 Editor(s): Roozeboom, Fred. Series: NATO Science Series E. Num Pages: 578 pages, biography. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 31. Weight in Grams: 989. . 1996. Hardback. . . . . Books ship from the US and Ireland. …

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.…

Paperback. Zustand: Brand New. 584 pages. 9.00x6.25x1.31 inches. In Stock.

Zustand: Very Good. : Este libro trata sobre el procesamiento térmico rápido de semiconductores, abordando los principios y aplicaciones de esta técnica en la fabricación de microdispositivos. Cubre aspectos teóricos y prácticos, incluyendo el diseño de equipos y el control de procesos. Es una referencia útil para ingenieros y científicos que trabajan en la industria de los semiconductores. EAN: 9781489918062 Tipo: Libros Categoría: Tecnología Título: Rapid Thermal Processing of Semiconductors Autor: Peter J. Hesketh| Victor E. Borisenko Idioma: en Páginas: 380 Formato: tapa blanda.…

Zustand: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.