Packaging introduction (20 Ergebnisse)

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Re-bound by library. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,950grams, ISBN:0150044860. …

Paperback. Zustand: Brand New. 150 pages. 11.00x8.50x0.38 inches. In Stock.

Zustand: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Book contains pencil markings. In poor condition, suitable as a reading copy. No dust jacket. Re-bound by library. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,900grams, ISBN:0136478425.…

hardcover. Zustand: Very Good.

Encuadernación de tapa blanda. Zustand: Perfecto. Van Nostrand Reinhold Company, USA, 1990. Texto en inglés. Arte. Diseño. Profusamente ilustrado. 212 pp. 23 x 19. Tapa blanda de editorial ilustrada. Sin subrayados ni anotaciones. PEGATINA EN BLANCO DE SIGNATURA EN PARTE INFERIOR LOMO, por lo demás: Perfecto estado de conservación. ISBN: 9780442318635. …

Zustand: New. In English.

Hardcover. Zustand: Brand New. 200 pages. 9.44x6.61x9.61 inches. In Stock.

Zustand: New. pp. 232.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. …

Taschenbuch. Zustand: Neu. Introduction to Microelectronics Advanced Packaging Assurance | Navid Asadizanjani (u. a.) | Taschenbuch | Synthesis Lectures on Engineering, Science, and Technology | xix | Englisch | 2026 | Springer | EAN 9783031861048 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Kartoniert / Broschiert. Zustand: New. Dr. Yufeng Jin received his Ph.D. degree in Electronical Engineering in March 1999 from Southeast University, Nanjing, China. Since then, he has been working as a postdoctoral fellow, an associate professor and a professor in Institute o.

Paperback. Zustand: Brand New. 232 pages. 10.00x7.00x10.00 inches. In Stock.

Taschenbuch. Zustand: Neu. Neuware.

Zustand: New. In English.

Zustand: New.

Hardcover. Zustand: Brand New. 2nd edition edition. 270 pages. 9.44x6.69x0.71 inches. In Stock.

Gebunden. Zustand: New. Dr. Yufeng Jin received his Ph.D. degree in Electronical Engineering in March 1999 from Southeast University, Nanjing, China. Since then, he has been working as a postdoctoral fellow, an associate professor and a professor in Institute o.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Bio-based plastics and nanocomposites can be used in improved packaging for food. The morphologies and physical and chemical properties of food packaging must be carefully controlled. This book covers topics such as: food packaging types, natural polymers, material properties, regulations and legislation, edible and sustainable food packaging, and trends in end-of-life options. This book is ideal for industrial chemists and materials scientists.…

Buch. Zustand: Neu. Neuware - Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.…

Zustand: New. 2020. 2nd edition. hardcover. . . . . . Books ship from the US and Ireland.