Lead free soldering (19 Ergebnisse)

2007th ed. 16 x 23 cm. 313 pages. HC Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. pp. 316 Illus.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Taschenbuch. Zustand: Neu. High-Lead Content Solder Alternatives | High-Temperature Lead-Free Soldering | Vivek Chidambaram (u. a.) | Taschenbuch | Englisch | LAP Lambert Academic Publishing | EAN 9783659162640 | Verantwortliche Person für die EU: LAP Lambert Academic Publishing, Brivibas Gatve 197, 1039 RIGA, LETTLAND, customerservice[at]vdm-vsg[dot]de | Anbieter: preigu. …

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In English.

Zustand: New. In English.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with le- free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena.…

Zustand: New.

Zustand: New. In English.

Hardcover. Zustand: Brand New. 1st edition. 299 pages. 9.25x6.50x1.00 inches. In Stock.

Hardcover. Zustand: Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.

Zustand: New. JASBIR BATH, is the owner of Bath Consultancy LLC which provides consulting and training services in the electronics manufacturing industry. He was the Corporate Lead Engineer with Solectron Corporation/ Flex for ten years with a role involving tin-lead and.

Zustand: New. 2020. 1st Edition. Hardcover. . . . . . Books ship from the US and Ireland.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with le- free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena.…

Hardcover. Zustand: Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.

Buch. Zustand: Neu. Neuware - Covering the major topics in lead-free solderingLead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production.Among other topics, the book addresses:\* Developments in process engineering (SMT, Wave, Rework, Paste Technology)\* Low temperature, high temperature and high reliability alloys\* Intermetallic compounds\* PCB surface finishes and laminates\* Underfills, encapsulants and conformal coatings\* Reliability assessmentsIn a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book's explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers.Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.…