bath jasbir (23 Ergebnisse)

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

2007th ed. 16 x 23 cm. 313 pages. HC Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.

Zustand: New. pp. 316 Illus.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In.

Zustand: New.

Zustand: New. pp. 300.

Hardcover. Zustand: Brand New. 1st edition. 299 pages. 9.25x6.50x1.00 inches. In Stock.

Hardcover. Zustand: Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with le- free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena.

Zustand: New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.

Gebunden. Zustand: New. Takahiko Kato, PhD, is a chief researcher in the Center for Technology Innovation - Materials, Research & Development Group at Hitachi Ltd, Tokyo, Japan. He is also a Guest Professor in the Center for Advanced Research of Energy and Materials at Hokkaido Un.

Hardcover. Zustand: Brand New. 1st edition. 272 pages. 8.00x5.00x1.00 inches. In Stock.

Zustand: New. 2020. 1st Edition. Hardcover. . . . . . Books ship from the US and Ireland.

Zustand: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. Editor(s): Kato, Takahiko; Handwerker, Carol A.; Bath, Jasbir. Series: Wiley Series on Processing of Engineering Materials. Num Pages: 272 pages. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 165 x 243 x 23. Weight in Grams: 586. . 2016. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The past few years have seen major developments in soldering materials and processes for electronics assembly manufacture due to the movement from tin-lead to lead-free soldering. The removal of lead from electronics solders due to environmental considerations first developed with proposed US legislation in the early 1990s. At that time, the alternatives had not been fully explored, so a ban on the use of lead in electronic solders was put on hold. However the seed was sown for development with various projects initiated during the 1990s in Europe, the Americas, and Asia. Based on government pressures, Japan OEMs began to move to lead-free solder products from 1998 and this, combined with the European Union ROHS (Restriction of Hazardous Substances) legislation enacted in 2006, drove the global manufacture of electronics consumer products with le- free solders. From 1998 to the present, the development of lead-free solder materials and processes has progressed to such an extent that development work moving forward will typically only concentrate on lead-free solders and components rather than tin-lead solders and components. This book aims to give the latest information on development of the lead-free soldering materials and processes and identify where more work is needed. The chapters of the book describe legislation, alloys, reflow, wave, rework, reliability, backward and forward process compatibility, PCB surface finishes and PCB laminates, and standards affecting the general lead-free soldering arena.

Buch. Zustand: Neu. Neuware - Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risksThis book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.\* Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution\* Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)\* Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)\* Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskersMitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

Hardcover. Zustand: Brand New. 1st edition. 284 pages. 9.75x6.50x1.00 inches. In Stock.