ISBN: 9780471594468 - integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability (12 Ergebnisse)

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Zustand: New. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840. . 1994. Hardcover. . . . . …

Zustand: New. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, an.

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Zustand: New. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840. . 1994. Hardcover. . . . . Books ship from the US and Ireland. …

Buch. Zustand: Neu. Neuware - Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: - Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost - Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data - Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures - Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved - Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate.wire and wire, tape automated, and flip-chip bonding.element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate.wire and wire, tape automated, and flip-chip bonding.element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.…