Radojcic riko (40 Ergebnisse)

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

paperback. Zustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned.…

PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New.

Hardcover. Zustand: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.

Zustand: New. 2025. paperback. . . . . . Books ship from the US and Ireland.

Paperback. Zustand: Brand New. 338 pages. 5.50x0.76x8.25 inches. In Stock.

Zustand: As New. Unread book in perfect condition.

Zustand: Bueno. : Este libro narra la historia de un programa de tecnología avanzada en la industria de los semiconductores. Explora la gestión y el desarrollo de la tecnología de integración More-than-Moore, ofreciendo una visión detallada de este campo especializado. Publicado en tapa dura, el libro consta de 211 páginas y es una valiosa fuente de información para aquellos interesados en la tecnología y la industria de los semiconductores. EAN: 9783319927008 Tipo: Libros Categoría: Tecnología Título: Managing More-than-Moore Integration Technology Development Autor: Riko Radojcic Páginas: 211 Formato: tapa dura.…

X, 211 p. Hardcover. Gestempelt/Stamped. Sprache: Englisch.

Zustand: As New. Unread book in perfect condition.

Zustand: As New. Unread book in perfect condition.

Zustand: As New. Unread book in perfect condition.

Zustand: NEW.

Zustand: New. pp. 224.

Hardcover. Zustand: Brand New. 224 pages. 9.25x6.10x0.70 inches. In Stock.

Zustand: New.

Zustand: New.

Taschenbuch. Zustand: Neu. Neuware - Big things often have small beginnings. As National Security Adviser to the President of the United States, Jane Stewart shepherds an act through congress to subsidize manufacturing of silicon chips on American soil. Argon Zhi, an executive at one of the world's best semiconductor foundries, accepts the responsibility to craft a plan for ensuring the competitiveness of Taiwan's technology companies and ensure the continued independence of his country. Cedric Dyson's job as a Failure Analysis engineer is to figure out why some chips do not work the way they are supposed to. When he notices a pattern among the failing chips sent to his FA lab, he uncovers a shocking truth. Jane, Argon and Cedric, each operating within their professional domains, make a series of decisions that lead to an international blame game which could escalate into an open conflict between the world's powers. Will a new silicon chip factory subsidized by the US government, an act of sabotage compromising a multi-billion dollar fab, and a Failure Analysis expert on the case lead the world to a brink of WWIII.…

Zustand: As New. Unread book in perfect condition.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.…

Paperback. Zustand: Brand New. 254 pages. 9.25x6.10x0.58 inches. In Stock.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Taschenbuch. Zustand: Neu. Managing More-than-Moore Integration Technology Development | A Story of an Advanced Technology Program in the Semiconductor Industry | Riko Radojcic | Taschenbuch | x | Englisch | 2019 | Springer | EAN 9783030064952 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

CRC Press, Boca Raton, 1998. 214 pages, paperback--- - former library book in good condition - 498 Gramm.