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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging) - Softcover

Buch 2 von 4: Electronic Packaging

Pecht, Michael; Radojcic, Riko; Rao, Gopal

 
9780367400064: Guidebook for Managing Silicon Chip Reliability (Electronic Packaging)
Softcover
ISBN 10: 0367400065 ISBN 13: 9780367400064
Verlag: CRC Press, 2019

Inhaltsangabe

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

  • failure sites, operational loads, and failure mechanism
  • intrinsic device sensitivities
  • electromigration
  • hot carrier aging
  • time dependent dielectric breakdown
  • mechanical stress induced migration
  • alpha particle sensitivity
  • electrostatic discharge (ESD) and electrical overstress
  • latch-up
  • qualification
  • screening
  • guidelines for designing reliability

    Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

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    Über die Autorin bzw. den Autor

    Pecht, Michael; Radojcic, Riko; Rao, Gopal

    Von der hinteren Coverseite

    Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

    „Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

    Verlag
    CRC Press
    Erscheinungsdatum
    2019
    Sprache
    Englisch
    ISBN 10 
    0367400065
    ISBN 13 
    9780367400064
    Einband
    Taschenbuch
    Anzahl der Seiten
    224
    Kontakt zum Hersteller
    Nicht verfügbar
    Verantwortliche Person
    gpsr@libri.de
    gpsr@libri.de

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