Paul s ho (20 Ergebnisse)

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Hardcover. Zustand: Good. 5th or later Edition. 24th ed. ; xxxvii, 1724 p. illus. (part col.) ; LCCN: 00-6383 ; LC: R121; Dewey: 610.3; NLM: W13; NAL: 448 ; OCLC: 165804 ; Comprehensive biomedical dictionary that reflects standard and current terminology derived from medicine and related disciplines. Official nomenclature from various fields used in compilation. Also includes eponyms, acronyms, abbreviations, and botanical terms, as well as generic and trade names of many drugs. Entries include pronunciation, derivation, plural, definition, and subentries. Cross references. Illustrations throughout." ; well worn copy, but hinges tight in a still serviceable copy ; flexible textured faux leather covers ; G. Book.…

Zustand: Gut. 457 p. Ex-Library Book in good condition. 9781558990951 Sprache: Englisch Gewicht in Gramm: 839.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Zustand: New.

Hardcover. Zustand: Good. 24th ed. ; xxxvii, 1724 p. illus. (part col.) ; LCCN: 00-6383 ; LC: R121; Dewey: 610.3; NLM: W13; NAL: 448 ; OCLC: 165804 ; Comprehensive biomedical dictionary that reflects standard and current terminology derived from medicine and related disciplines. Official nomenclature from various fields used in compilation. Also includes eponyms, acronyms, abbreviations, and botanical terms, as well as generic and trade names of many drugs. Entries include pronunciation, derivation, plural, definition, and subentries. Cross references. Illustrations throughout." ; some wear, but hinges tight ; flexible textured faux leather covers ; G. Book.…

Hardcover. Zustand: Brand New. 400 pages. 9.84x6.85x0.94 inches. In Stock.

Zustand: As New. Unread book in perfect condition.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Low dielectric materials are an important component of microelectronic devices. In this carefully edited volume the leading researchers give an introduction to and a survey of the various fields of dielectrics for IC integration. The book appeals to materials reserachers, electrical engineers and advanced students.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.…

Zustand: Fine. *Price HAS BEEN REDUCED by 10% until Monday, Nov. 2 (weekend sale item)* 302 pp., hardcover, previous owner's name to front free endpaper else fine. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. Photos available upon request. …

Gebunden. Zustand: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 386 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Zustand: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland. …

Zustand: As New. Unread book in perfect condition.

Buch. Zustand: Neu. Neuware - Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:\* Interconnect functions, characterisations, electrical properties and wiring requirements\* Low-k materials: fundamentals, advances and mechanical properties\* Conductive layers and barriers\* Integration and reliability including mechanical reliability, electromigration and electrical breakdown\* New approaches including 3D, optical, wireless interchip, and carbon-based interconnectsIntended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.…

Zustand: As New. Unread book in perfect condition.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Soft cover. Zustand: Very Good. 1st Edition. A complete run of one of the most important counter-culture reviews in American literary history. The reputation of the Evergreen Review grows ever more golden as time passes. Celebrated for its design, radical political content, and literary, intellectual excellence. First four issues signed by the editor and various contributors: issue no. 1 signed by Barney Rosset; no. 2, which introducted the Beat Movement to the nation while Howl was still in the midst of its obscenity trial, is signed by Rosset plus Lawrence Ferlinghetti, Gary Snyder, Michael McClure, and Allen Ginsberg; no. 3 is signed by both Rosset and Gary Snyder; no. 4 signed by Rosset and Robin Blaser. A remarkable Beat and American counter-culture high spot which rarely hits the market as a complete set, rarer still in this condition, and unheard of signed by Rosset and the key contributors. All numbered volumes very good or better; the Last Tango in Paris supplement is in good condition. Signed by Author(s). …