Meindl james d (24 Ergebnisse)

Paperback. Zustand: Very Good. Prompt Shipment, shipped in Boxes, Tracking PROVIDEDvery good-used book.

Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. Dust jacket in fair condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,500grams, ISBN:0471591572.…

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New.

hardcover. Zustand: New. In shrink wrap. Looks like an interesting title.

Zustand: New. Includes topics ranging from IBM's revolutionary copper process to an exploration into interconnect-aware computer architectures. Editor(s): Davis, Jeffrey A. (College of Computing, Georgia Institute of Technology, Atlanta, USA); Meindl, James D. Num Pages: 411 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 23. Weight in Grams: 779. . 2003. Hardback. . . . .…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration. …

Zustand: New.

Gebunden. Zustand: New. Is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystemsIt spans IC interconnect topics ranging from IBM s revol.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New. Includes topics ranging from IBM's revolutionary copper process to an exploration into interconnect-aware computer architectures. Editor(s): Davis, Jeffrey A. (College of Computing, Georgia Institute of Technology, Atlanta, USA); Meindl, James D. Num Pages: 411 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 23. Weight in Grams: 779. . 2003. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. Neuware - Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.…

Zustand: As New. Unread book in perfect condition.