Li suny (6 Ergebnisse)

Zustand: As New. Unread book in perfect condition.

Taschenbuch. Zustand: Neu. MicroSystem Based on SiP Technology | Suny Li | Taschenbuch | xviii | Englisch | 2023 | Springer | EAN 9789811900853 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Buch. Zustand: Neu. Neuware - An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flowWritten by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:\* Cavity and sacked dies design\* FlipChip and RDL design\* Routing and coppering\* 3D Real-Time DRC check\* SiP simulation technology\* Mentor SiP Design and Simulation PlatformDesigned to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.…

Paperback. Zustand: Brand New. 892 pages. 9.25x6.10x1.76 inches. In Stock.

Hardcover. Zustand: gut. 2022. MicroSystem Based on SiP Technology In deutscher Sprache. pages.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.…