Lee w c y (33 Ergebnisse)

Zustand: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

No Binding. Zustand: Very Good. ORIGINAL 1997 Article, disbound from journal; no covers; in very good condition. Journal.

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Book contains pencil markings In fair condition, suitable as a study copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,850grams, ISBN:0471574465.…

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. Dust jacket in fair condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,850grams, ISBN:9780471574460.…

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, and may have sticker on cover, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In fair condition, suitable as a study copy. Dust jacket in fair condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,950grams, ISBN:9780071134798.…

Hardcover. Zustand: Very Good. No Dust Jacket. Library stamps/marks/labels, otherwise light wear. Crisp hardcover. ; Ex-Library; 272 pages.

Soft cover. Zustand: Very Good. 10 issues: Spring 1993, Fall 1993, Fall 1994, Spring 1995, Autumn 1995, Autumn 1996, Autumn 1997, Autumn 1998, Fall 1999, Spring 2000. Includes articles on J.E.B. Stuart's Cavalry, a county seat for Fluvanna, the Wood family, Wilmington meetinghouses, the Fluvanna Fair (1914-1929), Fluvanna memoirs, the Wilmington Grange, Bremo Bluff (parts 1&2), and more. Cover wear to a couple of issues, generally VG-Fine.…

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Very Good. 2nd Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. …

Zustand: New.

Zustand: New. In English.

Paperback. Zustand: Brand New. 180 pages. 9.17x6.18x0.75 inches. In Stock.

Zustand: New. In English.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Zustand: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: New. pp. 728.

Red Cloth. Zustand: Very Good +. No Dust Jacket. First Edition. Red Cloth. First Edition. Very Good+, No Dust Jacket. "Compiled Under The Direction Of The Committee On Scientific Method In The Social Sciences Of The Social Science Research Council." 822 Pages, Slightly Age-Toned At Edges. Five Words Underlined In Red Pencil On Pg.Ix Of The Table Of Contents.No Other Underlining Or Marking. Previous Owner's Name In Very Light Pencil On Front Endpaper. Covers Clean And Unmarked. Top Of Spine Frayed. Bottom Of Spine Shelfworn. A Solid, Tight Book.…

Zustand: New. In English.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging. …

Zustand: New. In English.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: New. Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected. Editor(s): Lee, Y. C.; Chen, W.T.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 17. Weight in Grams: 565. . 1997. 1998th Edition. hardcover. . . . . Books ship from the US and Ireland. …

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 676 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Gebunden. Zustand: New. Revised and enlarged version that discusses how to design a mobile communications system. Comprehensively examines the mobile radio environment. Covers prediction of propagation loss, calculation and methods of reducing fades, interference, frequency plans .

Zustand: New. Y. C. Gary Lee. Professor Lee is a professor of respiratory medicine at University of Western Australia. His translational pleural research program at the Institute for Respiratory Health uniquely integrates clinical, laboratory and allied health .

Zustand: New. In English.

Hardcover. Zustand: Brand New. 1st edition. 224 pages. 9.49x6.46x0.59 inches. In Stock.