chen w t (26 Ergebnisse)

Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Broschur. Zustand: gut. 24 cm, handschr. Widmung, aus der Sammlung Alexander Tollmann. Sprache: deu.

SC. Zustand: Gut. , Obr., [WES70]. // Deu 300g.

15 S., 5 Taf., Urlaub bis 28. Juni 2026. Wir nehmen Ihre Bestellung gerne entgegen, die Auslieferung erfolgt Anfang Juli. Vielen Dank! Sprache: Deutsch Gewicht in Gramm: 500.

4 vols. 586 figs., 205 tabs., XXVII, 2130 p. Hardcover. In 4 volumes, not available separately. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Springer Reference. Sprache: Englisch.

Zustand: New. In.

Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: No Dust Jacket. Library stamps/marks/labels, otherwise light wear. Crisp hardcover. ; Ex-Library; 272 pages.

Zustand: very good. Quarto, 404, Vol. II only, illus., maps, figures, tables, appendices. Proceedings of a conference jointly sponsored by NASA, the Environmental Protection Agency, and the University of Maryland, and held at Coolfont Conference Center 12-15 April 1977. Representatives of federal and state government agencies engaged in research on the condition and evolution of the Chesapeake Bay composed a status report, presented current activities and future plans, and recommended a long-range future course of policies and programs.

Zustand: New. In.

Zustand: New. In.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Taschenbuch. Zustand: Neu. Manufacturing Challenges in Electronic Packaging | Y. C. Lee (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9781461376590 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Zustand: New. Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected. Editor(s): Lee, Y. C.; Chen, W.T.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 17. Weight in Grams: 565. . 1997. 1998th Edition. hardcover. . . . . Books ship from the US and Ireland.

Paperback. Zustand: Brand New. reprint edition. 465 pages. 10.50x8.25x1.00 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Zustand: New. In.

Zustand: New. A collection of papers inspired by the work of Britain's first Fields Medallist, Klaus Roth. Editor(s): Chen, W.W.L.; Gowers, W.T.; Halberstam, Heini; Schmidt, W.M.; Vaughan, R. C. Num Pages: 510 pages, 1 b/w illus. 5 tables. BIC Classification: PBH. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 228 x 152 x 31. Weight in Grams: 83. . 2009. Illustrated. hardcover. . . . . Books ship from the US and Ireland.

Hardcover. Zustand: Brand New. 1st edition. 491 pages. 8.75x6.00x1.25 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Klaus Roth's pioneering research in the field of number theory has led to important and substantial breakthroughs in many areas, including sieve theory, diophantine approximation, and irregularities of distribution. His work on the Thue-Siegel-Roth Theorem earned him a Fields Medal in 1958 - the first British mathematician to receive the honour. Analytic Number Theory: Essays in Honour of Klaus Roth comprises 32 essays from close colleagues and leading experts in those fields in which he has worked, and provides a great insight into the historical development of the subject matter and the importance of Roth's contributions to number theory and beyond. His influence is also discussed in relation to more recent mathematical advances. Extensive lists of references make this a valuable source for research mathematicians in many areas, an introductory overview of the subject for beginning research students, and a fitting long-awaited tribute to a great mathematician.

Zustand: New. In.

Hardcover. Zustand: Brand New. 1st edition. 336 pages. 10.50x7.50x1.00 inches. In Stock.

Zustand: New. Reinforced concrete structures are subjected to a complex variety of stresses and strains. The four basic actions are bending, axial load, shear, and torsion. This work develops one unified theory of reinforced concrete behavior that embraces and accounts for all four basic actions and their combinations. Series: New Directions in Civil Engineering. Num Pages: 336 pages, 12 black & white tables, 1 black & white halftones. BIC Classification: TNC; TNK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 178 x 19. Weight in Grams: 806. . 1992. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.

Soft cover. Zustand: Good. Softcover. Green covers with black lettering. Title page dated 1943. No copyright. 514 pages. Good condition. Covers rubbed and toned but whole. Binding is strong. Pages are toned but clean, there is some underlining in pencil in second half of book.

51 S. mit 1 in Tasche beiliegenden mehrfach gefalteten Karte, Sprache: Deutsch Gewicht in Gramm: 260 4°, Original-Karton (Softcover), Bibliotheks-Exemplar, Stempel auf Vorsatz, Deckel und Titel, Einband leicht knitterig, minimale Bleistiftanmerkungen, insgesamt gutes und innen sauberes Exemplar,

Soft cover. Zustand: Very Good. xii+831 pp., illustrations, bibliography, index. light cover wear, small tear at top & bottom of spine. Contents: The necessity of scientific education in China to-day; The peoples of Kwangtung: Their origin, migrations, and present distribution; The manufacture of leather in Canton; On the palm and sole prints of Chinese; Manufactures weather; The study of botany in Fukien; A note on Gnetum scandens; The Magnoliaceae of Kwangtung, Macao, and Hong Kong; The botany of Kwangtung and its relation to agriculture; Differentiating fungi by precipitation with water-soluble specific substances; The number of vascular bundles in Ephedra sinica and E. equisetina; Grasses of Canton vicinity; A brief historical survey of the Lingnan University Herbarium; The local resident's opportunity for productive work in the biological sciences in China; Unrecorded plants from Kwangtung Province II; A review of the literature on the growth of Bamboo; Remarks on citrus and citrus relatives in China; The marine and freshwater algae of China; The collection of mosquitoes in south China; On two species of Sphaeridium from the oriental region (Coleoptera, Hydrophilidae); Gall midges or gall gnats of the orient (Itonididae or Cecidomyiidae); The membracidae of China; A common moth and some of its enemies; The Brethnidae and Lycidae of China; Our present knowledge about the Pupipara of Tabanidae of China; A new species of stonefly from China (order Plecoptera, family Nemouridae); Biological notes on a Chrysomelid pest of bamboo; Termites, destroyers of wood and man's fight against them; Present status of our knowledge of the termites of China; Insect inhabitants of the fruiting sprays of the pagoda tree, Sophora japonica; Studies on the Chinese honey-bee; Some principles useful in solving economic biological problems; Study of Brachyplatus subaëneus Westw.; The nervous system of the white grub (the larva of Osmoderma socialis Horn) Part I. External characters of the nervous system; The nervous system of the white grub (the larva of Osmoderma socialis Horn) part II. Internal structure of the brain and ventral nerve cord; External morphology of the corn ear worm; The present status of knowledge bout Chinese Gryinidae; On the cricket locusts (Gryllacrids) of China; A list of the coprophagous Coleoptera of China; Notes on the life history of a wild silkworm; History of Rhynchocoris humeralis Thumb. (Hemiptera, Pentatomidae).