chen w t (23 Ergebnisse)

Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Broschur. Zustand: gut. 24 cm, handschr. Widmung, aus der Sammlung Alexander Tollmann. Sprache: deu.

15 S., 5 Taf., Sprache: Deutsch Gewicht in Gramm: 500.

4 vols. 586 figs., 205 tabs., XXVII, 2130 p. Hardcover. In 4 volumes, not available separately. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Springer Reference. Sprache: Englisch.

Zustand: New. In.

Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: No Dust Jacket. Library stamps/marks/labels, otherwise light wear. Crisp hardcover. ; Ex-Library; 272 pages.

2nd printing. 8vo. Original gilt lettered green cloth (boards lightly discoloured - otherwise VG), dustwrapper (edges chipped - in protective cover). Pp. viii + 341 (no inscriptions).

Zustand: very good. Quarto, 404, Vol. II only, illus., maps, figures, tables, appendices. Proceedings of a conference jointly sponsored by NASA, the Environmental Protection Agency, and the University of Maryland, and held at Coolfont Conference Center 12-15 April 1977. Representatives of federal and state government agencies engaged in research on the condition and evolution of the Chesapeake Bay composed a status report, presented current activities and future plans, and recommended a long-range future course of policies and programs.

Zustand: New. In.

Zustand: New. In.

Taschenbuch. Zustand: Neu. Manufacturing Challenges in Electronic Packaging | Y. C. Lee (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9781461376590 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Paperback. Zustand: Brand New. reprint edition. 465 pages. 10.50x8.25x1.00 inches. In Stock.

Zustand: New. Addresses both advanced packaging and manufacturing activities, enhanced by reviews and analysis. This book is useful as a reference for professionals who need to meet the goal of manufacturing with only one defective package in a million escaping undetected. Editor(s): Lee, Y. C.; Chen, W.T.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 17. Weight in Grams: 565. . 1997. 1998th Edition. hardcover. . . . . Books ship from the US and Ireland.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Zustand: New. In.

Zustand: New. A collection of papers inspired by the work of Britain's first Fields Medallist, Klaus Roth. Editor(s): Chen, W.W.L.; Gowers, W.T.; Halberstam, Heini; Schmidt, W.M.; Vaughan, R. C. Num Pages: 510 pages, 1 b/w illus. 5 tables. BIC Classification: PBH. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 228 x 152 x 31. Weight in Grams: 83. . 2009. Illustrated. hardcover. . . . . Books ship from the US and Ireland.

Hardcover. Zustand: Brand New. 1st edition. 491 pages. 8.75x6.00x1.25 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - A collection of papers inspired by the work of Britain's first Fields Medallist, Klaus Roth.

Zustand: New. In.

Hardcover. Zustand: Brand New. 1st edition. 336 pages. 10.50x7.50x1.00 inches. In Stock.

Zustand: New. Reinforced concrete structures are subjected to a complex variety of stresses and strains. The four basic actions are bending, axial load, shear, and torsion. This work develops one unified theory of reinforced concrete behavior that embraces and accounts for all four basic actions and their combinations. Series: New Directions in Civil Engineering. Num Pages: 336 pages, 12 black & white tables, 1 black & white halftones. BIC Classification: TNC; TNK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 178 x 19. Weight in Grams: 806. . 1992. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.

Soft cover. Zustand: Good. Softcover. Green covers with black lettering. Title page dated 1943. No copyright. 514 pages. Good condition. Covers rubbed and toned but whole. Binding is strong. Pages are toned but clean, there is some underlining in pencil in second half of book.