Cho kyun (16 Ergebnisse)

Zustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings In good all round condition. No dust jacket. Re-bound by library. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,900grams, ISBN:9027704686.…

Zustand: Good. Volume 1. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Dust jacket in good condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1050grams, ISBN:9027704686.…

Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: Good. Hardcover. Series in Food Material Science 1. Several superficial marks on dust jacket. Jacket leading corners, edges and spine ends are slightly worn. Small nicks on spine head of jacket. Minor tear on front lower edge of jacket next to leading corner. Hardcover spine ends are a little bumped. Leading corners are lightly bumped. Contents are clear on clean, sound pages. AM. Used.…

Zustand: Good. Volume 1. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. Re-bound by library. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1000grams, ISBN:9027704686.…

210x145mm, III - 155Seiten, Schönes Exemplar. Envoi groupé : les frais de port sont calculés sur le poids total de la commande ; chaque livre supplémentaire coûte donc beaucoup moins cher à expédier. Commandez plusieurs livres et économisez sur le port ! / Combined shipping: postage is charged on the total weight of your order, so each additional book ships at a reduced rate. Order several books from us and save on postage ! / Envois Europe : Droits et taxes inclus - aucun frais à la livraison / Shipments to Europe: Duties and taxes included - no delivery charges.…

Zustand: New. In English.

Paperback. Zustand: Brand New. 428 pages. 9.61x6.69x0.97 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - In recent years, the importance of material science, or the understanding of the physical properties of food materials in the progress of food engineering, has become more recognized. Increasing numbers of basic and applied studies in this area appear in numerous journals and literature scattered around various disciplines. This 'Series in Food Material Science' is planned to survey, collect, organize, review and evaluate these studies. By doing so, it is hoped that this series will be instrumental in bringing about a better understanding of the physical properties of food materials, better communication among scientists, and rapid progress in food engineering, science and technology. This volume, Theory, Determination and Control of Physical Properties of Food Materia/s, Volume I of the 'Series in Food Material Science', contains basic principles, methods and instrumental methods for determination and application of the modifi cation of physical properties. In this book, noted investigators in the subjects have pooled their knowledge and made it available in a condensed form. Every chapter is selfcontained with most of them starting with a review or introduction, including the viewpoint of the author. These should offer a beginner a very general introduction to the subjects covered, make the scientists and technologists in the field aware of current progress and allow the specialists a chance to compare different viewpoints.…

24 cm. original cloth. xii,416 pp. ills, diagrams. references. index. "Series in Food Material Science, Volume 1". -(small libr label, library stamps, with plasticized cover, slightly bumped, otherwise (very) good). 777g.

hardcover. Zustand: New. Special order direct from the distributor.

Zustand: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . …

Zustand: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti.

Hardcover. Zustand: Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock.

Zustand: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland. …

Hardcover. Zustand: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Couverture souple. Zustand: bon. RO40175752: 1975. In-12. Broché. Bon état, Couv. convenable, Dos satisfaisant, Intérieur frais. 155 pages. Etiquette de code sur le dos. Tampons et annotation de bibliothèque sur le 1er plat et en page de titre. Dos muet. . . . Classification Dewey : 430-Langues germaniques. Allemand.…