Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75) - Hardcover

Buch 62 von 233: Springer Series in Materials Science
 
9783540210498: Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75, Band 75)
Hardcover
ISBN 10: 3540210490 ISBN 13: 9783540210498
Verlag: Springer, 2004

Inhaltsangabe

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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Von der hinteren Coverseite

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Springer
Erscheinungsdatum
2004
Sprache
Englisch
ISBN 10 
3540210490
ISBN 13 
9783540210498
Einband
Gebundene Ausgabe
Anzahl der Seiten
519
Herausgeber
Alexe Marin, Gösele Ulrich
Kontakt zum Hersteller
ProductSafety@springernature.com
ProductSafety@springernature.com

Poststr. 9
Darmstadt
64293
Deutschland

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