Isbn: 9783540210498 - wafer bonding: applications and technology (springer series in materials science, 75, band 75) (3 Ergebnisse)

Zustand: New. In.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.…

Hardcover. Zustand: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock.