Ulsi technology (23 Ergebnisse)

Paperback. Zustand: Very Good. The book has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In fair condition, suitable as a study copy. No dust jacket. Library sticker on front cover. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1200grams, ISBN:9780070630628.…

Zustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. Clean from markings. In fair condition, suitable as a study copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1000grams, ISBN:9780071141055.…

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: As New. Unread book in perfect condition.

Hardcover. Zustand: Brand New. 220 pages. 9.00x6.25x0.75 inches. In Stock.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.…

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Zustand: As New. Unread book in perfect condition.

Zustand: New. In English.

Zustand: New. pp. xii + 666 Illus.

Gebunden. Zustand: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.

Gebunden. Zustand: New. Ultra Large Scale Integration (ULSI) refers to chips with more than 10,000,000 devices per chip. It is the natural outgrowth of VLSI (Very Large Scale Integration). ULSI Semiconductor Technology Atlas uses TEM (Transmission Electron Microscopy) micrographs .

Zustand: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland. …

Hardcover. Zustand: Brand New. 1st edition. 666 pages. 10.00x7.25x1.50 inches. In Stock.

Zustand: New. pp. 960.

Buch. Zustand: Neu. Neuware - Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:\* Interconnect functions, characterisations, electrical properties and wiring requirements\* Low-k materials: fundamentals, advances and mechanical properties\* Conductive layers and barriers\* Integration and reliability including mechanical reliability, electromigration and electrical breakdown\* New approaches including 3D, optical, wireless interchip, and carbon-based interconnectsIntended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.…

Zustand: New. Ultra Large Scale Integration (ULSI) refers to chips with more than 10,000,000 devices per chip. It is the natural outgrowth of VLSI (Very Large Scale Integration). ULSI Semiconductor Technology Atlas uses TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and associated problems. Num Pages: 666 pages, Illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 189 x 264 x 46. Weight in Grams: 1434. . 2003. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. Neuware - More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: \* Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation \* Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization \* Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development \* Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: \* More than 1,100 TEM images to illustrate the science of ULSI \* A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues \* Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs.…

Zustand: As New. Unread book in perfect condition.