Thermal management materials electronic (16 Ergebnisse)

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In English.

Zustand: New. Professor Xingyou Tian is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of.

Buch. Zustand: Neu. Neuware - Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

Buch. Zustand: Neu. Thermal Management Materials for Electronic Packaging | Preparation, Characterization, and Devices | Xingyou Tian | Buch | 368 S. | Englisch | 2024 | Wiley-VCH | EAN 9783527352425 | Verantwortliche Person für die EU: Wiley-VCH GmbH, Boschstr. 12, 69469 Weinheim, product-safety[at]wiley[dot]com | Anbieter: preigu. …

Zustand: New. In English.

Zustand: New. 2023. 1st Edition. hardcover. . . . . . Books ship from the US and Ireland.

Zustand: New.

Zustand: New. In English.

Zustand: New. In English.

Zustand: Gut. Zustand: Gut | Seiten: 640 | Sprache: Englisch | Produktart: Bücher | The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry¿s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.…

Taschenbuch. Zustand: Neu. Advanced Materials for Thermal Management of Electronic Packaging | Xingcun Colin Tong | Taschenbuch | xxii | Englisch | 2013 | Springer | EAN 9781461427926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.…

Paperback. Zustand: Brand New. 638 pages. 9.25x6.10x0.73 inches. In Stock.

Hardcover. Zustand: Brand New. 550 pages. 9.20x6.10x1.60 inches. In Stock.