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Verlag: Springer International Publishing, 2018
ISBN 10: 3319743813 ISBN 13: 9783319743813
Sprache: Englisch
Anbieter: Buchpark, Trebbin, Deutschland
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In den WarenkorbZustand: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
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In den WarenkorbZustand: New. 2019. Paperback. . . . . . Books ship from the US and Ireland.
Verlag: Springer International Publishing, Springer International Publishing Mär 2018, 2018
ISBN 10: 3319743813 ISBN 13: 9783319743813
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
EUR 106,99
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In den WarenkorbBuch. Zustand: Neu. Neuware -This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools.The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits.The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis.Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits;Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate;Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices;Offers design guidelines to reduce couplings by adding specific protections.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 204 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing Feb 2019, 2019
ISBN 10: 3030089762 ISBN 13: 9783030089764
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
EUR 106,99
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In den WarenkorbTaschenbuch. Zustand: Neu. Neuware -This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools.The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits.The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis.Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits;Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate;Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices;Offers design guidelines to reduce couplings by adding specific protections.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 204 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3030089762 ISBN 13: 9783030089764
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 106,99
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In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools.The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits.The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis.Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits;Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate;Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices;Offers design guidelines to reduce couplings by adding specific protections.
Verlag: Springer International Publishing, 2018
ISBN 10: 3319743813 ISBN 13: 9783319743813
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
EUR 106,99
Währung umrechnenAnzahl: 1 verfügbar
In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces a new approach to model and predict substrate parasitic failures in integrated circuits with standard circuit design tools.The injection of majority and minority carriers in the substrate is a recurring problem in smart power ICs containing high voltage, high current switching devices besides sensitive control, protection and signal processing circuits.The injection of parasitic charges leads to the activation of substrate bipolar transistors. This book explores how these events can be evaluated for a wide range of circuit topologies. To this purpose, new generalized devices implemented in Verilog-A are used to model the substrate with standard circuit simulators. This approach was able to predict for the first time the activation of a latch-up in real circuits through post-layout SPICE simulation analysis.Discusses substrate modeling and circuit-level simulation of parasitic bipolar device coupling effects in integrated circuits;Includes circuit back-annotation of the parasitic lateral n-p-n and vertical p-n-p bipolar transistors in the substrate;Uses Spice for simulation and characterization of parasitic bipolar transistors, latch-up of the parasitic p-n-p-n structure, and electrostatic discharge (ESD) protection devices;Offers design guidelines to reduce couplings by adding specific protections.
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In den WarenkorbHardcover. Zustand: Brand New. 204 pages. 9.25x6.10x0.71 inches. In Stock.
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In den WarenkorbZustand: New.