Modeling simulation high speed (10 Ergebnisse)

21 x 15 cm. Zustand: Gut. Band 77. XIV, 153 Seiten ; Mit Abbildungen Schriften aus dem Institut für Technische und Numerische Mechanik der Universität Stuttgart ; Softcover, original Broschur, Deckel aufgebogen. Innen in sehr gutem Zustand. In Englisch. Bitte beachten Sie unsere Bilder. B16-04-04E|S43 Sprache: Englisch Gewicht in Gramm: 195. …

Hardcover. Zustand: Fair. No Jacket. Missing dust jacket; Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Zustand: Good. No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used.…

hardcover. Zustand: New. In shrink wrap. Looks like an interesting title.

Zustand: New. In English.

Taschenbuch. Zustand: Neu. Modeling and Simulation of High Speed VLSI Interconnects | A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 (1994) | Michel S. Nakhla (u. a.) | Taschenbuch | 108 S. | Englisch | 2012 | Springer | EAN 9781461361718 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Zustand: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland. …

Gebunden. Zustand: New. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec.

Paperback. Zustand: Brand New. reprint edition. 106 pages. 10.20x7.60x0.40 inches. In Stock.

Zustand: gut. 2023. Dynamics of High-Speed Maglev Trains: Modeling and Simulation with the Multibody Systems Approach In deutscher Sprache. pages.