Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
EUR 10,88 für den Versand von Vereinigtes Königreich nach USA
Versandziele, Kosten & DauerEUR 13,72 für den Versand von Vereinigtes Königreich nach USA
Versandziele, Kosten & DauerAnbieter: PsychoBabel & Skoob Books, Didcot, Vereinigtes Königreich
Hardcover. Zustand: Good. Zustand des Schutzumschlags: No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used. Artikel-Nr. 264019
Anzahl: 1 verfügbar
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Zustand: New. In. Artikel-Nr. ria9780792394419_new
Anzahl: Mehr als 20 verfügbar
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland. Artikel-Nr. V9780792394419
Anzahl: 15 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field. Artikel-Nr. 9780792394419
Anzahl: 1 verfügbar