Sprache: Englisch
Verlag: New York, NY ;s.l., Springer New York., 2014
ISBN 10: 1461488818 ISBN 13: 9781461488811
Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
Online-Ressource (XIII, 95 p. 63 illus., 37 illus. in color) online resource. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Analog Circuits and Signal Processing, 116.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 113,12
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 114,85
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 148,24
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 108 pages. 9.00x6.00x0.50 inches. In Stock.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 150,73
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 2014 edition. 142 pages. 9.25x6.25x0.25 inches. In Stock.
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Embedded Memory Design for Multi-Core and Systems on Chip | Baker Mohammad | Taschenbuch | xiii | Englisch | 2016 | Springer New York | EAN 9781493948017 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.