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This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
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This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
· Provides a comprehensive overview of embedded memory design and associated challenges and choices;
· Explains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory design;
· Includes detailed discussion of memory hierarchy and its impact on energy and performance;
· Uses real product examples to demonstrate embedded memory design flow from architecture, to circuit design, design for test and yield analysis.
Titel: Embedded Memory Design for Multi-Core and ...
Verlag: Springer
Erscheinungsdatum: 2013
Einband: Hardcover
Zustand: New
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory. Artikel-Nr. 24116585/12
Anzahl: 1 verfügbar
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. Neuware -This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 112 pp. Englisch. Artikel-Nr. 9781461488804
Anzahl: 2 verfügbar
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory. Artikel-Nr. 9781461488804
Anzahl: 1 verfügbar
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
Hardcover. Zustand: Brand New. 2014 edition. 142 pages. 9.25x6.25x0.25 inches. In Stock. Artikel-Nr. x-146148880X
Anzahl: 2 verfügbar