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Coupled data communication techniques (10 Ergebnisse)

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  • Sprache: Englisch

    Verlag: Springer, 2010

    1441965874 / 9781441965875

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  • Sprache: Englisch

    Verlag: Springer, 2012

    1461426170 / 9781461426172

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    Zustand: New. In English.

  • Sprache: Englisch

    Verlag: Springer, 2010

    1441965874 / 9781441965875

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  • Sprache: Englisch

    Verlag: Springer, 2010

    1441965874 / 9781441965875

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  • Sprache: Englisch

    Verlag: Springer-Verlag New York Inc., US, 2010

    1441965874 / 9781441965875

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    Hardback. Zustand: New. 2010 ed. Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.…

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    Sprache: Englisch

    Verlag: Springer, 2012

    1461426170 / 9781461426172

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    Taschenbuch. Zustand: Neu. Coupled Data Communication Techniques for High-Performance and Low-Power Computing | Ron Ho (u. a.) | Taschenbuch | Integrated Circuits and Systems | xvi | Englisch | 2012 | Springer | EAN 9781461426172 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

  • Sprache: Englisch

    Verlag: Springer Us, 2010

    1441965874 / 9781441965875

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    Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a aw. If such aws were the result only of dust one might reduce their numbers, but aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.…

  • Sprache: Englisch

    Verlag: Springer, 2012

    1461426170 / 9781461426172

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    Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a aw. If such aws were the result only of dust one might reduce their numbers, but aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.…

  • Sprache: Englisch

    Verlag: Springer-Verlag New York Inc., 2012

    1461426170 / 9781461426172

    • Softcover

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    Paperback. Zustand: Brand New. 222 pages. 9.20x6.10x0.51 inches. In Stock.

  • Sprache: Englisch

    Verlag: Springer-Verlag New York Inc., US, 2010

    1441965874 / 9781441965875

    • Hardcover

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    Hardback. Zustand: New. 2010 ed. Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.…