Paperback. Zustand: Fair. 4. The item might be beaten up but readable. May contain markings or highlighting, as well as stains, bent corners, or any other major defect, but the text is not obscured in any way.
Anbieter: World of Books (was SecondSale), Montgomery, IL, USA
Zustand: Good. Item in very good condition! Textbooks may not include supplemental items i.e. CDs, access codes etc.
Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Zustand: Gut. Zustand: Gut | Seiten: 552 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes Königreich
EUR 254,94
Anzahl: 15 verfügbar
In den WarenkorbPAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 289,75
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 338,77
Anzahl: 3 verfügbar
In den WarenkorbZustand: New. pp. 560.
EUR 315,87
Anzahl: Mehr als 20 verfügbar
In den WarenkorbKartoniert / Broschiert. Zustand: New. Bridging the gap between logical design and VLSI design, this text has been revised to reflect recent computer engineering developments. It includes new information on CAD tools, PLAs, NMOs and standard-cell CMOS methodologies.Tied to no particular set .
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 392,40
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 4th sub edition. 534 pages. 10.25x7.50x1.25 inches. In Stock.
EUR 405,98
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Bridging the gap between logical design and VLSI design, this text has been revised to reflect recent computer engineering developments. It includes new information on CAD tools, PLAs, NMOs and standard-cell CMOS methodologies. Num Pages: 560 pages, Illustrations. BIC Classification: TJFC; UGC; UY. Category: (UU) Undergraduate. Dimension: 256 x 181 x 31. Weight in Grams: 954. . 1993. 4th Edition. Paperback. . . . . Books ship from the US and Ireland.