ISBN: 9787111755807 - 扇出晶圆级封装、板级封装及嵌入技术 高性能计算(hpc)和系统级封装(sip) (美)贝思·凯瑟,(德)斯蒂芬·克罗纳特 编 吴向东 等 译 (1 Ergebnisse)
Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
[ MEI ] BEI SI· KAI SE ( Beth Keser ) . [ DE ] SI DI FEN· KE LUO NA TE
- Softcover
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paperback. Zustand: New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.…
