Sprache: Englisch
Verlag: Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
EUR 280,69
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.