Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 49,02
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 56,85
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In den WarenkorbPaperback. Zustand: Brand New. 107 pages. 10.00x7.00x0.50 inches. In Stock.
Sprache: Englisch
Verlag: Morgan & Claypool Publishers, 2017
ISBN 10: 1681740591 ISBN 13: 9781681740591
Anbieter: Leopolis, Kraków, Polen
Soft cover. Zustand: New. 8vo (25 cm), XIV, 94 pp. Laminated wrappers. Synopsis: It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance. Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.