Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 271,41
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In den WarenkorbZustand: New. In.
Taschenbuch. Zustand: Neu. Moisture Sensitivity of Plastic Packages of IC Devices | E. Suhir (u. a.) | Taschenbuch | xiv | Englisch | 2012 | Springer US | EAN 9781461426257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Sprache: Englisch
Verlag: Springer-Verlag New York Inc., 2012
ISBN 10: 1461426251 ISBN 13: 9781461426257
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 381,68
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In den WarenkorbPaperback. Zustand: Brand New. 572 pages. 9.20x6.10x1.33 inches. In Stock.