9780470662540 - advanced interconnects for ulsi technology von baklanov, mikhail; ho, paul s.; zschech, ehrenfried (2 Ergebnisse)
- Hardcover
Anbieter: moluna, Greven, Deutschlandmoluna
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 233,70
EUR 48,99 VersandVersand von Deutschland nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 318,22
EUR 9,21 VersandVersand innerhalb von USAAnzahl: 15 verfügbar
Zustand: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; H…o, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland.
