Isbn: 9780071753791 - reliability of rohs-compliant 2d and 3d ic interconnects (electronic engineering) (5 Ergebnisse)

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Zustand: Used. pp. 640.

Zustand: Used. pp. 640.

Zustand: New. Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integrationProven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D I.

Buch. Zustand: Neu. Neuware - Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.Covers reliability of: 2D and 3D IC lead-free interconnectsCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder jointsLead-free (SACX) solder jointsLow-temperature lead-free (SnBiAg) solder jointsSolder joints with voids, high strain rate, and high ramp rateVCSEL and LED lead-free interconnects3D LED and 3D MEMS with TSVsChip-to-wafer (C2W) bonding and lead-free interconnectsWafer-to-wafer (W2W) bonding and lead-free interconnects3D IC chip stacking with low-temperature bondingTSV interposers and lead-free interconnectsElectromigration of lead-free microbumps for 3D IC integration.…