Isbn: 9780071434843 - failure-free integrated circuit packages: systematic elimination of failures through reliability engineering, failure analysis, and material ... (mcgraw-hill professional engineering) (3 Ergebnisse)

Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Gebunden. Zustand: New. The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.SPOT..

Buch. Zustand: Neu. Neuware - SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDEWorth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques.Failure-Free Integrated Circuit Packages helps you:Find, identify, and correct potential failures before they occurImprove device reliabilityLearn from case studies of IC package failure modesQuickly locate failures through visual comparisonsApply state-of-the-art failure analysis techniquesComprehend the physics behind the failure mechanismUnderstand the limitations of reliability testing and lifetime estimationINSIDE, YOU'LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE:Fundamentals of IC package technologiesReliabilityPhysics and chemistry of failures in packaged devicesStrategies for locating failuresFailure analysis techniquesFailure modes common in organic IC packagesEmerging assembly materials for IC packaging.…