Isbn: 9780070366480 - solder joint reliability of bga, csp, flip chip, and fine pitch smt assemblies (electronic packaging and interconnection series) (2 Ergebnisse)

Hardback. Zustand: Good. Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.…

Hardcover. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.