Ytterdal trond (23 Ergebnisse)

Zustand: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

Zustand: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.…

paperback. Zustand: Good. No Dust Jacket. some minor rubbing along the edges and ends of the covers, pages are clean, bright and tight.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: new.

Zustand: New.

Zustand: New.

Zustand: Gut. Zustand: Gut | Seiten: 424 | Sprache: Englisch | Produktart: Bücher | A detailed guide to SPICE-oriented design and testing of electronic devices SPICE allows engineers to simulate individual semiconductor devices and electronic circuits and to perform the large number of different analyses needed for tasks such as verification of circuit designs and prediction of circuit performance. However, these simulations are only as good as the device models and parameters used in the simulations. Wrong models yield unreliable results. Introduction to Device Modeling and Circuit Simulation links electronic device modeling to simulation of these devices using the SPICE program. Ideal as a reference for professional engineers or as a text for courses in semiconductor device modeling, it presents * A combination of background device physics and technology * A review of existing device models * A set of new and improved models compatible with the most advanced technology * Descriptions of device models and examples of circuit simulations Following an introduction to SPICE, this book covers charge transport in semiconductors, two-terminal devices, bipolar junction transistors, field effect transistors, and advanced FET modeling. With its concentration on modeling and simulation, Introduction to Device Modeling and Circuit Simulation is the core book on SPICE-oriented semiconductor device modeling.…

Zustand: As New. Unread book in perfect condition.

Zustand: New. In English.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New. In English.

Zustand: New.

Zustand: New. * Bridges the gap between device modelling and analog circuit design. * Includes dedicated software enabling actual circuit design. * Covers the three significant models: BSIM3, Model 9 &, and EKV. * Presents practical guidance on device development and circuit implementation. Num Pages: 306 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 255 x 179 x 24. Weight in Grams: 712. . 2003. 1st Edition. Hardcover. . . . .…

Zustand: New. pp. xiii + 292 Illus.

Zustand: New. pp. 424.

Hardcover. Zustand: Brand New. 304 pages. 9.75x6.75x1.00 inches. In Stock.

Zustand: New. * Bridges the gap between device modelling and analog circuit design. * Includes dedicated software enabling actual circuit design. * Covers the three significant models: BSIM3, Model 9 &, and EKV. * Presents practical guidance on device development and circuit implementation. Num Pages: 306 pages, Illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 255 x 179 x 24. Weight in Grams: 712. . 2003. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

Hardcover. Zustand: Brand New. 1st edition. 409 pages. 9.75x6.50x1.00 inches. In Stock.

Buch. Zustand: Neu. Neuware - Mit Hilfe des SPICE Programms können Anwendungsentwickler und EDV-Ingenieure individuelle Bauelemente und elektronische Schaltungen simulieren, eine ganze Reihe verschiedener Analysen (z. B. zur Verifizierung von Schaltungsentwürfen) durchführen und Prognosen zur Leistungsfähigkeit dieser Schaltungen abgeben. Jedoch sind die Ergebnisse einer SPICE Simulation nur so gut wie die eingesetzten Bauelementmodelle und Parameter.Ein außerordentlich praxisorientiertes Buch, das viele Beschreibungen zu Bauelementmodellen mit einer entsprechend großen Zahl gut vorbereiteter Beispiele für Schaltungssimulationen enthält. (11/97).…