xingcun colin tong (26 Ergebnisse)

Hardcover. Zustand: Very Good. 1. Auflage. unread, with some shelfwear.

Zustand: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.

Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.

Taschenbuch. Zustand: Neu. Neuware -This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 580 pp. Englisch.

Buch. Zustand: Neu. Neuware -This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 580 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.

Zustand: New. In.

Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher.

Zustand: New. In.

Zustand: New. In.

Taschenbuch. Zustand: Neu. Neuware -To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 296 pp. Englisch.

Buch. Zustand: Neu. Neuware -To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 296 pp. Englisch.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Zustand: New. In.

Hardcover. Zustand: Brand New. 2014 edition. 552 pages. 9.25x6.25x1.25 inches. In Stock.

Zustand: New. In.

Buch. Zustand: Neu. Neuware -The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry¿s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 640 pp. Englisch.

Taschenbuch. Zustand: Neu. Neuware -The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry¿s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 640 pp. Englisch.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Hardcover. Zustand: Brand New. 277 pages. 9.25x6.25x0.75 inches. In Stock.

Hardcover. Zustand: Brand New. 1st edition. 360 pages. 9.57x6.50x0.87 inches. In Stock.

Paperback. Zustand: Brand New. 638 pages. 9.25x6.10x0.73 inches. In Stock.

Hardcover. Zustand: Brand New. 550 pages. 9.20x6.10x1.60 inches. In Stock.