Tsui chi ying (13 Ergebnisse)
Chinese Love Poems
Po Chu-i; Prince Li Yo; Chien T'Ang; Chu Tun-Ru; Niu Hsi-Chi; Jan Ju Yu; Wu-Ti; Tzu Yeh; Ts'ui Ying Ying; Shen Yo
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Zustand: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Weitere Bilder- Hardcover
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Zustand: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged. Second impression, 1943. No dust jacket. A slight tan to the page edges, and a previous owner's name…on the flyleaf. Otherwise fine. A clear, bright copy within.
Verlag: George Allen & Unwin
- Hardcover
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In den WarenkorbZustand: Very Good. 1943. Hardcover. Very good clean copy in original cloth covers. Title in tilt to spine. Small nick on the spine. Ex-Libris with stamps on ffep, remains very good. . . . . Books ship from the US and Ireland.
Verlag: George Allen & Unwin 1943
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In den WarenkorbZustand: Very Good. 1943. Hardcover. Very good clean copy in original cloth covers. Title in tilt to spine. Small nick on the spine. Ex-Libris with stamps on ffep, remains very good. . . . .
VLSI-SoC: The Advanced Research for Systems on Chip: 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, Hong Kong, China, October 3-5, 2011, Revised Selected Papers (IFIP Advances in Information and Communication Technology)
Mir, Salvador (Editor) / Tsui, Chi-Ying (Editor) / Reis, Ricardo (Editor) / Choy, Oliver C.S. (Editor)
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Paperback. Zustand: Brand New. revised edition. 200 pages. 9.25x6.10x0.46 inches. In Stock.
VLSI-SoC: Design for Reliability, Security, and Low Power: 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers (IFIP Advances in Information and Communication Technology)
Shin, Youngsoo (Editor) / Tsui, Chi Ying (Editor) / Kim, Jae-Joon (Editor) / Choi, Kiyoung (Editor) / Reis, Ricardo (Editor)
Sprache: Englisch
Verlag: Springer 2018
Serie: IFIP Advances in Information and Communication Technology, Buch 143 von 292. Buch 143 von 292 - IFIP Advances in Information and Communication Technology
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Paperback. Zustand: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.
- Softcover
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in…the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing 2018
Serie: IFIP Advances in Information and Communication Technology, Buch 143 von 292. Buch 143 von 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in th…e book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
- Hardcover
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EUR 62,36 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the boo…k were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Sprache: Englisch
Verlag: Springer International Publishing 2016
Serie: IFIP Advances in Information and Communication Technology, Buch 143 von 292. Buch 143 von 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book…were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
Sprache: Englisch
Verlag: Springer 2018
Serie: IFIP Advances in Information and Communication Technology, Buch 143 von 292. Buch 143 von 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Zustand: Neu. VLSI-SoC: Design for Reliability, Security, and Low Power | 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers | Youngsoo Shin (u. a.) | Taschenbuch | IFIP Advances in Information and Communication T…echnology | xiii | Englisch | 2018 | Springer | EAN 9783319834405 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Softcover
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Taschenbuch. Zustand: Neu. VLSI-SoC: The Advanced Research for Systems on Chip | 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, Hong Kong, China, October 3-5, 2011, Revised Selected Papers | Salvador Mir (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Techno…logy | x | Englisch | 2014 | Springer | EAN 9783642445095 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
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Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in…the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
