Toshiro doi (22 Ergebnisse)

hardcover. Zustand: Fine.

Zustand: new. New.

Zustand: New. Editor(s): Marinescu, Ioan D.; Doi, Toshiro; Uhlmann, Eckart. Num Pages: 544 pages, illustrations. BIC Classification: TDCQ. Category: (P) Professional & Vocational. Dimension: 232 x 159 x 24. Weight in Grams: 916. . 2014. 2nd Edition. Hardcover. . . . .

Zustand: New.

hardcover. Zustand: New. Special order direct from the distributor.

Gebunden. Zustand: New. Provides readers with experience-based insights into complex and expensive processes, leading to improved quality control, lower failure rates, and cost savings Covers the fundamentals of ceramics side-by-side with processing issues and ma.

Hardcover. Zustand: New. In shrink wrap. Looks like an interesting title.

Zustand: As New. Unread book in perfect condition.

Hardback. Zustand: New. CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge RandD accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.…

Hardcover. Zustand: Brand New. 2nd edition. 486 pages. 9.25x6.25x1.25 inches. In Stock.

Zustand: New. Editor(s): Marinescu, Ioan D.; Doi, Toshiro; Uhlmann, Eckart. Num Pages: 544 pages, illustrations. BIC Classification: TDCQ. Category: (P) Professional & Vocational. Dimension: 232 x 159 x 24. Weight in Grams: 916. . 2014. 2nd Edition. Hardcover. . . . . Books ship from the US and Ireland.…

Gebunden. Zustand: New. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CM.

Zustand: New.

Hardcover. Zustand: New. Brand new book, sourced directly from publisher. Dispatch time is 7-8 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Hardback. Zustand: New. CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge RandD accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.…

Hardcover. Zustand: new. Hardcover. Handbook of Ceramics Grinding and Polishing Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Zustand: As New. Unread book in perfect condition.

Zustand: New. Marinescu, Ioan D. Uhlmann, Eckart Doi, ToshiroLapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the.

Zustand: New. pp. 512.

Buch. Zustand: Neu. Neuware - Describes the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. This book presents an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. It builds on this foundation to discuss lapping of ductile and brittle materials.…

Hardback. Zustand: Brand New. 1st edition. 491 pages. 9.50x6.25x1.25 inches. In Stock.

Zustand: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…