Tan cher ming (37 Ergebnisse)

Zustand: Used. pp. 236.

Zustand: Used. pp. 236.

Zustand: New. In English.

Zustand: New. In English.

Zustand: New. In English.

Paperback. Zustand: Brand New. 2013 edition. 112 pages. 9.37x6.14x0.39 inches. In Stock.

Hardcover. Zustand: Brand New. 150 pages. 9.25x6.50x0.50 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This edited book tells the story of the multifaceted efforts devoted by a 'future school' in Singapore-The Nan Chiau Primary School-in shaping future learning. It documents the various measures implemented by one primary school to improve student learning outcomes in a technology-rich teaching and learning environment. With the current interest in Singapore's 'Masterplan for ICT (information and communication technology) in Education,' and the increasing focus on teaching and learning design by leading education researchers and professionals, this well-timed book will appeal to policy makers, educators and researchers.…

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.…

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This edited book tells the story of the multifaceted efforts devoted by a 'future school' in Singapore-The Nan Chiau Primary School-in shaping future learning. It documents the various measures implemented by one primary school to improve student learning outcomes in a technology-rich teaching and learning environment. With the current interest in Singapore's 'Masterplan for ICT (information and communication technology) in Education,' and the increasing focus on teaching and learning design by leading education researchers and professionals, this well-timed book will appeal to policy makers, educators and researchers.…

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Taschenbuch. Zustand: Neu. Electromigration Modeling at Circuit Layout Level | Cher Ming Tan (u. a.) | Taschenbuch | SpringerBriefs in Applied Sciences and Technology | ix | Englisch | 2013 | Springer | EAN 9789814451208 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Zustand: New. In English.

Zustand: New. In English.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New. In English.

Zustand: New.

Zustand: New.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This edited book tells the story of the multifaceted efforts devoted by a ¿future school¿ in Singapore¿The Nan Chiau Primary School¿in shaping future learning. It documents the various measures implemented by one primary school to improve student learning outcomes in a technology-rich teaching and learning environment. With the current interest in Singapore¿s ¿Masterplan for ICT (information and communication technology) in Education,¿ and the increasing focus on teaching and learning design by leading education researchers and professionals, this well-timed book will appeal to policy makers, educators and researchers.…

Zustand: New.

Paperback. Zustand: Brand New. 2011 edition. 208 pages. 9.25x6.10x0.38 inches. In Stock.

Hardcover. Zustand: Brand New. 157 pages. 9.20x6.30x0.70 inches. In Stock.

Taschenbuch. Zustand: Neu. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections | Cher Ming Tan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | viii | Englisch | 2013 | Springer | EAN 9781447126416 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Zustand: New. In English.

Hardcover. Zustand: Brand New. 1st edition. 312 pages. 9.50x6.25x0.75 inches. In Stock.

Zustand: New. In English.

Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics.To help readers cope with the increasing sophistication of FEMs¿ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will:introduce the principle of FEMs;review numerical modeling of ULSI interconnect reliability;describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; anddiscuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method.A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader¿s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included.Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability. …

Hardcover. Zustand: Brand New. 250 pages. 9.25x6.00x0.50 inches. In Stock.

Zustand: New. In English.

Zustand: New. In English.