Shichun (12 Ergebnisse)

Hardcover. Zustand: As New. Hardcover. Cover shows very minor shelving wear, otherwise an unblemished copy.; 100% Satisfaction Guaranteed! Ships same or next business day.

Paperback. Zustand: Brand New. 112 pages. 9.00x6.00x0.27 inches. In Stock. HAN, XIAOQING (illustrator).

hardcover. Zustand: Very Good.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | Shichun and his young son An-an have put together a delightful comic book that is not only amusing but shares positive insights into the Chinese traditions and culture and what it means to be a true friend. The iconic Panda and his friends will teach young readers how to be a good buddy.The reference notes share the interesting history and culture of China in a very upbeat style.…

Zustand: Good. : Este libro trata sobre el empaquetado a nivel de oblea a escala de chip y sus aplicaciones en semiconductores analógicos y de potencia. Cubre aplicaciones analógicas y de semiconductores de potencia. EAN: 9781493954384 Tipo: Libros Categoría: Tecnología Título: Wafer-Level Chip-Scale Packaging Autor: Yong Liu| Shichun Qu Editorial: Springer Idioma: en Páginas: 339 Formato: tapa blanda.…

Zustand: New. In English.

Paperback. Zustand: Brand New. reprint edition. 339 pages. 9.25x6.10x0.80 inches. In Stock.

Taschenbuch. Zustand: Neu. Advanced Battery Management System for Electric Vehicles | Shichun Yang (u. a.) | Taschenbuch | Key Technologies on New Energy Vehicles | xxii | Englisch | 2023 | Springer | EAN 9789811934926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Zustand: Sehr gut. Zustand: Sehr gut | Seiten: 340 | Sprache: Englisch | Produktart: Bücher | Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.…

Hardcover. Zustand: Brand New. 322 pages. 9.25x6.25x1.00 inches. In Stock.