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  • Sprache: Englisch

    Verlag: Elektor Verlag, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: PBShop.store US, Wood Dale, IL, USAPBShop.store US

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    Zustand: Neu

    EUR 27,89

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    PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

  • Sprache: Englisch

    Verlag: Elektor Verlag, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes KönigreichPBShop.store UK

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    Zustand: Neu

    EUR 25,87

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    PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

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    In den Warenkorb

    Softcover. Zustand: Fine. First edition. Perfectbound wrappers. 170pp. Fine. Poetry, short stories, and more by David St. John, Carol Snow, Raymond Queneau, Charles Bernstein, Boris Pasternak, Daniel Hoffman, Jennifer Clarvoe, Herbert Morris, Suzanne Gardinier, Lydia Davis, Paul Lake, Richard Jones, Lisa Lewis, Martin Greenberg, Johann Wolfgang von Goethe, Norman Finkelstein, Clark Coolidge, Jane Mead, Christopher Benfey, Russell Banks, Sven Birkerts, Wendy Lesser, and John Berger.

  • Sprache: Englisch

    Verlag: Elektor Verlag, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books

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    Zustand: Neu

    EUR 27,11

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    perfect. Zustand: Brand New. 144 pages. 9.41x0.39x6.69 inches. In Stock.

  • Sprache: Englisch

    Verlag: Elektor Verlag Mai 2026, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH

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    Zustand: Neu

    EUR 42,34

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    Taschenbuch. Zustand: Neu. Neuware - This book explains how to carry out reliable SMD assembly using affordable tools and small-scale equipment. It follows the complete workflow step by step, including tool selection, solder paste handling, stencil use, component placement, reflow methods, inspection, and rework. The focus is on bench-level and small-lab production rather than industrial assembly lines. It shows practical methods for building single and double-sided SMD boards with repeatable results. Topics include solder paste and flux, temperature profiles, hot air and hotplate techniques, small reflow ovens, inspection methods, and defect correction. Checklists and example workflows are included to help reduce errors and improve consistency. Key features: Tools and supplies for SMD assembly and rework Solder paste types, storage, and handling Stencils and paste application methods Pick and place workflow and component orientation Temperature profiles and reflow methods Hot air, hotplate, and reflow oven processes Inspection and quality control Common defects such as tombstoning and solder bridges Practical rework and component replacement Bench-level professional workflows and checklists This book is designed as a practical bench reference for anyone who wants to assemble and troubleshoot their own SMD boards with reliable results.

  • Sprache: Englisch

    Verlag: Elektor Verlag, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: moluna, Greven, Deutschlandmoluna

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    Zustand: Neu

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    Zustand: New.

  • Sprache: Englisch

    Verlag: Elektor Verlag Mai 2026, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschlandbuchversandmimpf2000

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    Zustand: Neu

    EUR 27,99

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    Taschenbuch. Zustand: Neu. Neuware -This book explains how to carry out reliable SMDassembly using affordable tools and small-scale equipment. It follows the complete workflow step by step, including tool selection, solder paste handling, stencil use, component placement, reflow methods, inspection, and rework.The focus is on bench-level and small-lab production rather than industrial assembly lines. It shows practical methods for building single and double-sided SMD boards with repeatable results.Topics include solder paste and flux, temperature profiles, hot air and hotplate techniques, small reflow ovens, inspection methods, and defect correction. Checklists and example workflows are included to help reduce errors and improve consistency.Key features:- Tools and supplies for SMD assembly and rework- Solder paste types, storage, and handling- Stencils and paste application methods- Pick and place workflow and component orientation- Temperature profiles and reflow methods- Hot air, hotplate, and reflow oven processes- Inspection and quality control- Common defects such as tombstoning and solder bridges- Practical rework and component replacement- Bench-level professional workflows and checklists This book is designed as a practical bench reference for anyone who wants to assemble and troubleshoot their own SMDboards with reliable results.GPSR Kontakt, Heinrich-Schütz-Allee 35, 34131 Kassel 144 pp. Englisch.

  • Sprache: Englisch

    Verlag: Elektor Verlag, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: preigu, Osnabrück, Deutschlandpreigu

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    Zustand: Neu

    EUR 23,75

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    Taschenbuch. Zustand: Neu. Professional SMD Assembly | Practical Low-Cost Methods for Reliable PCB Production | Paul Rudman | Taschenbuch | 144 S. | Englisch | 2026 | Elektor Verlag | EAN 9783895767289 | Verantwortliche Person für die EU: Elektor Verlag GmbH, Roel Willems, Lukasstr. 1, 52070 Aachen, roel[dot]willems[at]elektor[dot]com | Anbieter: preigu.

  • Sprache: Englisch

    Verlag: Elektor Verlag Mai 2026, 2026

    389576728X / 9783895767289

    • Softcover

    Anbieter: Books-by-Floh, Paderborn, DeutschlandBooks-by-Floh

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    Zustand: Neu

    EUR 35,56

    EUR 105,00 Versand 
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    Anzahl: 2 verfügbar

    Taschenbuch. Zustand: Neu. Neuware -This book explains how to carry out reliable SMDassembly using affordable tools and small-scale equipment. It follows the complete workflow step by step, including tool selection, solder paste handling, stencil use, component placement, reflow methods, inspection, and rework.The focus is on bench-level and small-lab production rather than industrial assembly lines. It shows practical methods for building single and double-sided SMD boards with repeatable results.Topics include solder paste and flux, temperature profiles, hot air and hotplate techniques, small reflow ovens, inspection methods, and defect correction. Checklists and example workflows are included to help reduce errors and improve consistency.Key features:- Tools and supplies for SMD assembly and rework- Solder paste types, storage, and handling- Stencils and paste application methods- Pick and place workflow and component orientation- Temperature profiles and reflow methods- Hot air, hotplate, and reflow oven processes- Inspection and quality control- Common defects such as tombstoning and solder bridges- Practical rework and component replacement- Bench-level professional workflows and checklists This book is designed as a practical bench reference for anyone who wants to assemble and troubleshoot their own SMDboards with reliable results. 144 pp. Englisch.

  • Zustand: Gebraucht

    EUR 89,85

    EUR 4,36 Versand 
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    Anzahl: 1 verfügbar

    In den Warenkorb

    Wraps. Presumed first edition/first printing. Various paginations--[8], xii, 83, [70] pages. Chapter refernces. Glossary. List of Key Gulf War Illness Studies and Reports. Matrix of Case Narratives. Title from Transmittal letter printed inside front cover. Additional members of the Oversight Board were CSM David Moore and RADM Alan Steinman. President Clinton established the Special Oversight Board by Executive Order 13075 in response to a recommendation from the Presidential Advisory Committee on Gulf War Illnesses (PAC). The Board's charter (Appendix C) called for it to "provide advice and recommendations AND OVERSIGHT.of Department of Defense investigations into possible detections of; and exposures to, chemical or biological weapons agents and environmental and other factors that may have contributed to gulf war illnesses.AND TO PROVIDE AN overall evaluation of DoD's plan for and progress toward the implementation of the 12 recommendations contained in the PAC's Special Report" Good. Cover has swome wear and soiling.