Hardcover. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
VII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Structural Integrity, 13. Sprache: Englisch.
Sprache: Englisch
Verlag: Crc Press-2018 (Special Indian Edition), 2018
ISBN 10: 0367025558 ISBN 13: 9780367025557
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
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Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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In den WarenkorbZustand: New. pp. 516.
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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EUR 74,49
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In den WarenkorbZustand: New.
Sprache: Englisch
Verlag: World Scientific Pub Co Inc, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
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Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
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In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Anbieter: Romtrade Corp., STERLING HEIGHTS, MI, USA
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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In den WarenkorbEinband - flex.(Paperback). Zustand: New. Diego Galar has a Msc in Telecommunications and a PhD degree in Manufacturing from the University of Saragossa. He has become Professor in several universities, including the University of Saragossa or the European University of Madrid. .
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In den WarenkorbPaperback. Zustand: Brand New. 489 pages. 10.00x7.00x10.00 inches. In Stock.
Sprache: Englisch
Verlag: World Scientific Publishing Company, Incorporated, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 130,68
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In den WarenkorbZustand: New. pp. 440.
Sprache: Englisch
Verlag: World Scientific Publishing Co Pte Ltd, 2022
ISBN 10: 9811256845 ISBN 13: 9789811256844
Anbieter: PBShop.store US, Wood Dale, IL, USA
HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbPaperback. Zustand: Brand New. 2nd new edition. 304 pages. 10.00x7.01x0.87 inches. In Stock.
Sprache: Englisch
Verlag: World Scientific Publishing Co Pte Ltd, 2022
ISBN 10: 9811256845 ISBN 13: 9789811256844
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In den WarenkorbHRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Sprache: Englisch
Verlag: World Scientific Publishing Company, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
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HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
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In den WarenkorbZustand: New. pp. 288.
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In den WarenkorbZustand: New. In.
Sprache: Englisch
Verlag: World Scientific Pub Co Inc, 2017
ISBN 10: 981314825X ISBN 13: 9789813148253
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 163,29
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In den WarenkorbZustand: New. pp. 550.
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In den WarenkorbZustand: New. In.
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EUR 164,08
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In den WarenkorbPaperback. Zustand: Brand New. 348 pages. 9.25x6.10x0.91 inches. In Stock.
Sprache: Englisch
Verlag: World Scientific Publishing Company, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes Königreich
EUR 171,87
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In den WarenkorbHRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
Sprache: Englisch
Verlag: Springer International Publishing, 2021
ISBN 10: 3030328333 ISBN 13: 9783030328337
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
Zustand: Hervorragend. Zustand: Hervorragend | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.